The ultimate report to weight the strength and weakness of existing 3D ICs technologies, and see who is doing what in term of 3D packaging among the key players

The technical issues for innovative 3D packaging at the wafer level are close to be solved.

Yole?s latest report highlights the market drivers for 3D packaging technologies, the status of developments, how it will impact the semiconductor food chain. It covers  as well equipments market forecasts and technical analyses of the different solutions with extensive exclusive technical explanation, figures and abstracts.

3D integration will affect the IC, MEMS and image sensors markets!
Semiconductor chips face constant pressure for increased performances while still decreasing their size and at the same time their packages must be able to accommodate new functionalities. The ever-expanding consumer electronics market is a particularly strong driver of packaging innovations such as 3D ICs. Today wire bonding is limited in density and performances so 3D stacking with micro-vias (or TSV, ?through-Si vias?) seems to be unavoidable in the future for miniaturization first and increased performances after.

3D integration will use technologies originally developed for MEMS technology but for different markets. In our report, we have analyzed that portable applications are a strong market driver for 3D integration. Stacking memories, stacking memories and logic, image sensors with µP and FPGAs will be the first mass market applications. In 2010, we forecast that 1 billion of Flash memories will be stacked with TSVs

3D-ICs: the technical challenges are close to be overcome
3D is the most ?integrated? approach and is an enabling technology platform applicable to digital and mixed signal electronics, wireless, electro-optical, MEMS, sensors, smart imagers, displays and other devices. There are however strong challenges. They are: thermal management, reliable co-design and simulation tools, industrial wafer-to-wafer bonding tools, low-cost through-wafer via structures and via fill processes. In our report we have analyzed and compared the different technical solutions

List of interviewed companies:
3D-Plus, All-via, Amkor, ASE, ASM International, Dow Corning, E2V, EM Microelectronics, Fraunhofer IZM , Freescale, Fujikura, Fujitsu, Hymite, Hynix Semiconductor, IMEC, Infineon, Intel, Leti, Matsushita Electric Works, MEMSiC, Micron, MicroResist, NEC, Nokia, Philips Image Sensors, Philips Semiconductors, Rensselaer Polytechnic Institute, Samsung, Semitool, SensoNor, Silex, SPIL, STATSChipPac, STMicroelectronics, SÜSS microtec, Synova, Tessera, Texas Instruments, Tezzaron, TSMC, VTI Technologies, VTT Technology, Xintec, XSil, Ziptronix, Zycube

Author
Dr. Eric Mounier ,  PhD in microelectronics (1989)
Co-founder of Yole Developpement
In charge of market analysis for MEMS, optoelectronics and new advanced packaging
Micronews Chief Editor

Price: 3490?  for your price in dollar please contact us Khamassi@yole.fr at +33 472 83 01 95

Corporate licence (multiple locations/many readers):  4490?

Length: 230 pages (PowerPoint® format in pdf file)