Introduction

Why stacking chips in 3D...........................................................4

Market drivers for 3D ICs ............................................................5

3D Packaging integration landscape ............................................6

3D TSV interconnects Roadmap .................................................7

Enabling Packaging technologies ................................................8

3D ICs Market Forecasts ............................................................9

Worldwide 3D IC activity mapping

Geographical Breakdown ............................................................11

3D TSV Infrastructure & Supply chain ..........................................12

Applications/Markets Segmentation .............................................13

Status of industrialization ............................................................14

3D TSV scenarios developed .......................................................15

Company Profiles

3D-Plus .....................................................................................18

Allvia .........................................................................................31

Amkor .......................................................................................38

ASE ..........................................................................................44

ASET ........................................................................................50

DALSA Semiconductor ...............................................................58

Elpida Memory ...........................................................................70

EPworks ....................................................................................82

Fraunhofer Institutes ................................................................... 92

Freescale Semiconductor ............................................................104

Hymite .......................................................................................120

Hynix Semiconductor ..................................................................133

IBM ...........................................................................................141

IMEC ........................................................................................ 154

Intel ...........................................................................................170

Irvine Sensors .............................................................................179

KTH .......................................................................................... 189

Leti ........................................................................................... 196

MagnaChip ................................................................................ 211

Micron ...................................................................................... 219

Nanya ........................................................................................233

NEC Electronics .........................................................................239

NXP Semiconductor ....................................................................247

OKI Electric ............................................................................. .259

Qimonda .................................................................................. .271

Renesas ................................................................................... 285

RPI ...........................................................................................297

Samsung ..................................................................................309

Sanyo .......................................................................................323

Schott .......................................................................................340

Sharp ........................................................................................352

Silex Microsystems ....................................................................360

Sony .........................................................................................375

Spansion ...................................................................................383

STATS ChipPAC ........................................................................389

ST Microelectronic ......................................................................397

Tessera .....................................................................................416

Tezzaron .................................................................................. 429

Tohoku University .......................................................................447

Toshiba .................................................................................... 457

Tracit Technologies ....................................................................468

TSMC ...................................................................................... 483

VTI .......................................................................................... 489

Xintec ...................................................................................... 501

Ziptronix ................................................................................... 508

ZyCube .................................................................................... 527

Annexes

OptoPAC WL-CSP.....................................................................542

Northrop Grumman ....................................................................543

MIT TWV realizations ................................................................544

Sematech TWI Roadmap ...........................................................546

3D IC Database informations ......................................................547